What’s new in cooling solution – Ultra-thin Vapor Chamber

Notwithstanding the global is under the pandemic of COVID-19, the focus on 5G development remains strong. For hardware design, the heat dissipation will be always the major concern for 5G products. We have introduced the working principle of Vapor Chamber (VC) and its thermal capacity. In this edition, we announce the new evolution named Ultra-thin VC (UVC).

In order to meet the space limitation, the thickness of VC started from 5mm to 0.7mm and now UVC advances to 0.3mm and supports temperature from 120°C to 175°C. Currently Zaward can offer thickness of UVC in 0.3mm and below. It is the top-notch technology in thermal field and the diffusion bonding technology in vacuum enables to bond two
different materials without paste and changing the properties of materials.

UVC structure

UVC is consist of the top cover, upper mesh, support columns, lower mesh and bottom cover.

Unlike heat pipes, the VC /UVC allow drilled holes to facilitate easy installation, customize irregular shapes, which conform closely to the surface of the heat source and make rapid heat dissipation. Attributes of UVC make the best use for devices with thin profiles or space restrictions. In recent years, technical problems of VC

such as leakage, assembly, and liquid fillings have been overcome and costs are much more affordable and competitive compared to before, see manufacture process below.

Wicking structure
When it comes to heat pipe, the wicking structure plays a
significant role. Currently, there are types of structures and it has been evolving from mesh in the early stage to sinter powder, groove and composite (groove + sinter powder), the latter three are the most adopted structures nowadays. Performance-wise, composite is superior to sinter powder then follows by groove.

Application

Mobile phone
Laptops, tablets, and low-profile devices
Electric vehicles
5G application
Embedded PC
Iot
Telecom
Laser projector

Other than vapor chambers, Zaward provides comprehensive product lines of thermal
solution. From DC/AC fan, diversified processes of heat sinks, to peripheral components such as heat- pipes, fan guards, and thermal pads. We are always well prepared to solve any cooling issues with our best passion for customers worldwide.
For more product details, please feel free to visit our website. Any inquiries about thermal solutions are welcome. If you have any questions, please contact us. Any topics you want to know more, share your thoughts with us.

With best regards,

ZAWARD CORPORATION

Carmen Chen/ Managing Director

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