Solution for closed environment
     How to tackle with compacted product 

 
“Alexa, turn on the light; Google, play that song“– Yes, AI and 5G have been slowly integrated into on our daily basis, which brings us convenience and mobility. It means data explosion, network complexity and industry adoption are the looming challenges. People seek for “All-in-one” solution and demand compacted product and device with multi-functions which may result in component failures over time when not building in proper thermal solution. To extend the life expectancy of electronic products, thermal management is the key to success.
 

 

 

 
 

 
When it comes to a closed environment, the followings should factor in.
 

  • Enclosure dimensions
  • Internal heat load in watts
  • Ambient temperature variables (Max and min ambient temperature)
  • Location (Indoor/outdoor)
  • Mounting method
  • Other factors (air-conditioner, heater in ambience, etc.)

 
When the thermal solution is designed, maintenance is another task. Various solutions apply to different situations. Cooling solution is categorized into two – active and passive thermal management.
 

Passive cooling olution
 
If your goal is to keep your closed devices silent and reduce failure, using a passive cooling solution is the best choice. Passive = no noise, no fan.
Passive cooling solution, in general, is without fans, which relies on the heat sinks solely to take away heat from a device. 

They derive heat gain control through evaporation, convection, and radiation without any intermediate electrical device or driver. To optimize heat dissipations, heat pipes, interface such as TIM or improved materials will be added to passive coolers to enhance thermal resistance.

 
Good natural convection or air-conditioned ambience can benefit heat conduction through aluminium or alloy casing. On the flip side, in a harsh environment such as outdoor long-lasting sunshine, it would accelerate system ageing and result in system failure. In this case, surface treatment and design are vital.
The advantages of passive thermal management are cost-effective, energy-efficient, and no noise
 

 
Applications
 
  • Laptops, 1 U rack server,
  • BGA and board-level product
  • Industrial control equipment
  • Telecommunications equipment
  • Automotive
 
  • Broadcast
  • Wireless equipment
  • Medical equipment
  • Solar system
  • Electronic industry.
 

 
Active cooling solutions, on the other hand, refers to a combination of the heat sink and the fan, using the fan to remove the heat quickly from components and advance efficiency and stability of the system. The disadvantages of active thermal management are higher costs and noise, compared to passive cooling.
Zaward’s active coolers are compatible with Intel- LGA775, 1150 (Haswell), 1155, 1156, 2011 and AMD- AM2, AM3 CPUs. Every cooler includes mounting kits and brackets thoughtfully designed for easy installation on any system.
The benefits of Zaward’s active coolers:
Life expectancy, 70,000 hours at 40˚C
Mounting feature for all models
Powerful airflow up to 88.03CFM
High-density heat sink fins create large dissipation surfaces
Light weight
 

 
The benefits of Zaward’s active coolers:

  • Life expectancy, 70,000 hours at 40˚C
  • Mounting feature for all models
  • Powerful airflow up to 88.03CFM
  • High-density heat sink fins create large dissipation surfaces
  • Light weight
 

 
Zaward provides comprehensive product lines of thermal solution. From DC/AC fan, diversified processes of heat sinks, to peripheral components such as heat-pipes, fan guards, and thermal pads. We are always well prepared to solve any cooling issues with our best passion for customers worldwide.
For more product details, please feel free to visit our website. Any inquiries of thermal solutions are welcome. If you have any questions, please contact us.
 

 
With best regards, 
ZAWARD CORPORATION
 

 
Carmen Chen/ Managing Director