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ZAWARD Thermal Technology Insights
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How to Choose Your Ideal Heat Sink
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Heat sink is the fundamental solution in thermal industry. With various heat sink processes and surface treatments, what is the best method to choose and design the ideal heat sink? Power dissipation, Application, Surroundings and Dimension are the four key factors to start with.
How to choose your ideal heat sink
Heat dissipation is the key function of heat sink to stabilize the operating system without overheating issues. Factors listed below are significant metrics when it comes to heat sink choice and design.
- Power Dissipation: How many Walt shall be dissipated from the heat source on the device.
- Application: PC market, industrial PC, telecom device and medical equipment … etc.
- Surrounding: Operating environment and heat source.
- Dimension: Appropriate dimension of heat sink
Design your ideal heat sink
- Material
- Thermal conductivity
- Dimension
- Surface treatment
> Material:
Aluminum (e.g AL-6061 / AL-6063) and copper (e.g C1100) alloys are common materials utilized for heat sinks subject to solution customer requires. For each individual process, we adopt suitable material to maximize efficiency of thermal dissipation and fulfil customized requirements. Below is a quick list of materials used for various processes.
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Extrusion process, for instance, A6063 can achieve complicated shape and variable surface treatment and A6061 offers better hardness and can be formed superbly for wide application.
For stamping process, A1050 / 1060 / 1100 series consists of pure aluminum plate, where A5052 is suitable for an outlook-centric item thanks to its’ sufficient Mg content and option of anodizing implement.
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>Thermal Conductivity :
It’s the fundamental factor of heat sink design and choice and it affects life expectancy and system efficiency radically. The higher the thermal conductivity is, the better the heat-dissipating performs.
Factors like hardness, thickness and area of thermal dissipation should be considered thoroughly to create the most optimized heat sink.
Dimension:
From small size chipset to mega-size heat sink for industrial field and telecom devices, we can customize various dimensions according to respective requirements. For extrusion process, we can reach 5~900 mm (Length) and 5~470 mm (Width); for skiving process, maximum length can be 3000 mm and width ranges from 25~800 mm.
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Fin part plays an important role in skiving process, its’ thickness, pitch, gap, height and intensity are key factors that vary the performance. In a nutshell, intensive fin optimizes heat dissipation capacity, however, heat source and structure of the system should also be put into consideration. Zaward has fully equipped simulation test to ensure heat sinks are produced with the best and strongest functions
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> Surface Treatment
Every heat sink has surface treatment. Basic degrease wash process is most considered, following by Oxidization or Anodizing as a precaution process. Other advanced treatments like Powder coating, Sandblasting and Hair-line management are perfectly conducted with our equipment as well.
Zaward Capacity of heat sink:
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- Extrusion
- Skiving
- Bonding
- Forging
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- Die casting
- CNC machining
- Stamping
- Complex multi-structure
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Other than heat sink, we also provide complete product series of a wide range of dimensions DC/AC fan and blower. Regarding any issue of thermal solution and heat dissipation, we are always ready with our passionate enthusiasm to provide you with professional cooling advice. For more information about our products, please visit our website. If you have any questions, please feel free to contact us.
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With best regards,
ZAWARD CORPORATION
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Carmen Chen/ Managing Director
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