Numerous electronic circuits are on the printed circuit board (PCB), particularly for semiconductor devices such as microprocessors, diodes, rectifiers, transistors, etc. The primary task is to reduce temperature for smooth operation. The design concept of Board level Heat sink is to attach the device (semiconductor) and the PCB and build surface area for heat dissipation.
Board level heat sink boosts the optimal performance of semiconductor devices and enhances their maximum reliability. Majority of the board level heat sinks are made of aluminum or copper in stamping or extrusion process. They are designed for regular package sizes of T0220, TO-262, TO247, and D2pak.