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Vapor Chamber in New Application
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Technology is evolving every day, and rising environmental awareness and sustainability are the catalysts for accelerating the efficiency of electronic components. To ensure electronic equipment’s stability and smooth operation, adapting the right cooling product is essential.
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| Vapor Chamber
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High heat transfer capability with two-phase cooling in planar form. For electronics cooling applications, thermal energy transfer is typically over a heat sink in close proximity to the heat source; making vapor chamber assemblies ideal for spreading high heat densities or heat loads over a larger surface.
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| Product Feature
a. Vacuum Diffusion Bonding
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Zaward’s vapor chamber implements vacuum diffusion bonding. It significantly lessens impurity and oxidation during the bonding process. Sturdy bonding structure in Grain and no protection gas occupied on bonding surfaces. It offers higher reliability in long-term operating.
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This process bonds upper cover, mesh, support columns and lower mesh, base plate into a rigid cahmber. Despite its highest initial facility cost of diffusion bonding, it creates the ultimate bonding strength to parent metal.
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b. VC can withstand up to 200℃ heat resistance based on structure design and have long life expectancy.
c. Quickly spread to the large heat source in a small area and dissipate rapidly, averaging the temperature.
d. Perfect for limited space or high-wattage thermal dissipation and implementing for liquid cooling design.
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| Application
– 5G Industry
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- 5G WiFi router
- 5G Chip
- Communication antenna module
- Surveillance system radar system
- Wireless base station.
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– Automotive
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- Battery packs for electric vehicles
- Intelligent driver assistance systems
- Charging station
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– Optoelectronics
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- Laser printer
- Scanner
- 3D printer
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With a vapor chamber, you can expect increased and more uniform heat spreading, which is ideal for optimizing heat sink performance. It is a reliable heat transfer device with no moving parts or corrosive materials.
Vapor chamber usage has increased significantly as both total power and power density have risen dramatically due to decreasing chip size. As to price and application flexibility, today’s vapor chambers are more capable and less costly than those a decade ago.
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Zaward’offers comprehensive product lines of thermal solutions. From DC/AC fan, diversified processes of heat sink, to peripheral components such as heat pipes, fan guards, and thermal pads. Zaward’s products are widely applied in 5G, AI, Server, Solar energy, medical, LED lighting, military, and more. We are always well prepared to solve any cooling issues with our best passion for customers worldwide.
For more product details, please feel free to visit our website. Any inquiries about thermal solutions are welcome. If you have any questions, please contact us. Any topics you want to know more about, share your thoughts with us.
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With best regards,
ZAWARD CORPORATION
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Carmen Chen/ Managing Director
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© 2022 ZAWARD CORPORATION.
5F.-4, No.130, Jiankang Rd., Zhonghe Dist., New Taipei City 23585, Taiwan
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