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| 5G Mobile Phone Thermal Solution |
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Image: <a href=’https://www.freepik.com/vectors/people’>People vector created by vectorjuice – www.freepik.com</a>
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5G mobile phone has landed in 2020, it is the next generation of mobile data connectivity, bringing super-fast speeds and improved connection reliability and stability over 4G. It’s about 10 times faster than 4G with wireless communication less than1ms latency, and data rates up to 20 gigabits per second (Gbit/s), and awesome for tasks like streaming movies, online gaming and heavy files download way faster than it has ever been. For heavy mobile phone users like many of us, the thermal management considerations cannot be overlooked for 5G smartphone designers because it affects not only the phone reliability but also the leakage of energy consumption.
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Predominate thermal solutions for 5G mobile phone
Power dissipation of 4G mobile phone is around 3W and 11W for 5G. Low power and high efficiency are the focus of developers, let alone the other heat-generating components such as image sensors, light surces and batteries.
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By and large, smartphones are classified into three tiers and with respective thermal solutions as following.
High-tier: Vapor Chamber+ Graphite
Mid-tier: Heat pipe+Graphite
Low-tier: Graphite
Image right: Photo by Janitors on Wunderstock (license)
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Graphite, heat pipe, and vapor chamber are the predominate 5G mobile thermal solutions; the latter two own the rapid heat transfer properties of heat conduction and refrigeration media. The thermal conductivity is more than 10 times higher than metal and graphite materials, they have been widely adopted in 5G mobile thermal management.
Table of comparison for Heat Pipe, VC and Graphite
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Graphite Sheet has a unique honeycomb structure that allows thermal transfer in two directions and diffuses rapidly. The advantages of Graphite Sheet are high thermal conductivity, effective heat spreading, easy to install and EMI reduction. Zaward offers product in 21µm(=0.021mm) and 25µm(=0.025mm) .
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It owns supreme thermal conductivity, 2-4 times higher than copper, 3-7 times better than aluminium and 10 times than stainless. It also combines very well with metal, plastic, stickers and other materials to meet the design features and needs. Lightweight and large specific surface area, it is a very suitable material to be used in 5G thermal management. Learn more
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Heat pipe consists of an envelope, a wick and a working fluid, which combines both thermal conductivity and phase transition to effectively transfer heat between two solid interfaces. The heat pipe contacts the surface of the heat source, the working fluid turns into vapor in the fully sealed vacuum pipe, then vapor flows along the cavity to the cold interface and condenses back into the liquid and is absorbed by the wick (capillary action) to release the heat. Image right: https://www.myfixguide.com/vivo-iqoo-teardown/2/
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The liquid then returns to the heat source and repeats the cycle. To meet the space limitation in mobile phones, Zaward’s slim heat pipe can satisfy the needs in narrow and limited space with a flat surface for heat dissipation. |
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Vapor Chamber has the same working principle as a heat pipe, utilizing the same two-phase cooling process. To meet the space limitation, the thickness of VC started from 5mm to 0.7mm and now UVC advances to 0.3mm and supports temperature from 120°C to 175°C.
Currently, Zaward can offer a thickness of UVC at 0.3mm. It is the top-notch technology in the thermal field and the diffusion bonding technology in a vacuum enables to bond two different materials without paste and changing the properties of materials.
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It is a perfect solution for 5G mobile devices and can dissipate heat quickly to avoid possible dreadful failures. Our vapor chambers are carefully inspected under the strictest testing procedures of 100% Helium leak test, on-line ageing test and thermal resistance test.
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Mobile phone with Vapor Chamber Image source: ASUS ROG Phone www.asus.com
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Vapor Chamber Specification
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Apart from Graphite Sheet, Heat Pipe, Vapor Chamber, Zaward provides comprehensive product lines of thermal solution. From DC/AC fan, diversified processes of heat sinks, to peripheral components such as heat-pipes, fan guards, and thermal pads. We are always well prepared to solve any cooling issues with our best passion for customers worldwide.
For more product details, please feel free to visit our website. Any inquiries about thermal solutions are welcome. If you have any questions, please contact us. |
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With best regards,
ZAWARD CORPORATION
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Carmen Chen/ Managing Director
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© 2020 ZAWARD CORPORATION.
5F.-4, No.130, Jiankang Rd., Zhonghe Dist., New Taipei City 23585, Taiwan
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