Vapor Chamber
Vapor Chamber
Vapor chamber is similar to heat pipe in flat copper plate form, filled with working fluid. It is vacuumed and then injected with just enough liquid (e.g. water) to wet the wick.
Capillary structure is applied on the inside wall, and enables liquid changes to vapor phase bringing the heat from evaporation section in all directions to cooling zone (condenser), followed by the capillary force of wick brings working fluid back to evaporation section and continue the cycle.
Planar heat transmission, which transfers heat in all directions, enables vapor chamber can direct contact with the heat source, functions as part of the heat sink base and improves the heat sink’s heat transfer.The thickness of vapor chamber is from 5mm to 0.7mm and now there is an Ultra vapor Chamber advances to 0.3mm and supports temperature from 120°C to 175°C.
VaporChamber
Heatpipe
Specification
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Application & Industry
- Mobile phone
- Laptops, tablets, and low-profile devices
- Electric vehicles
- 5G applications
- Embedded PC
- IoT
- Telecom
- Laser projector